Awọn iroyin Ile-iṣẹ

Chip Packaging ibamu sobusitireti Orisi

2024-10-14

Eyi ni tabili ti apoti Chip ti o baamu awọn iru sobusitireti ti o baamu

 

Iru sobusitireti.

Awọn ọna iṣakojọpọ

Awọn orukọ iṣakojọpọ

Ko si sobusitireti ti a beere

Fan-Jade

 

 

WLCSP

 

Organic sobusitireti

Wire-bond

 

BGA, LGA , CSP 4909101} )

 

Flip-Chip

 

BGA ( FC BGA, FO lori Sobusitireti, 2.5D, 3D {42963109} {4909109} 08014}  CSP

 

Sobusitireti fireemu asiwaju

Wire-bond

 

QFN/QFP, SOIC, TSOP, LCC, DIP

 

Flip-Chip

 

FC QFN

 

Seramiki sobusitireti

Wire-bond

 

Hi Rel

 

Flip-Chip

 

HTCC, LTCC

 

 

Ti o ba fẹ kọ ẹkọ diẹ sii tabi alaye diẹ sii nipa awọn sobusitireti, kan tẹ {449080CT{41}USCONTA 4909101} "   bọtini lori oke, awọn tita wa yoo sọ fun ọ diẹ sii nigba ti o n gba awọn aṣẹ.